We shall exhibit at "SEMICON Japan 2024"

Thin film contract processing (Small ~ Mid-volume production) (Thin film deposition, Photolitho, Etching, NIL)

Solutions for Advanced R&D

Processing service for Power Devices

• Processing services for SiC, GaN, Ga₂O₃ substrates.
  (Various methods of film formation and materials, Photolitho, Etching etc.)
• Rewiring, Wafer bonding, Plating anode (CuP) for UBM.

Advanced development needs

• Supporting 300mm wafer, 3D packaging.

Processing service for VR/AR

• Nanoimprint processing
   (using high refraction index resin)
• Grating mold fabrication
• Nanoimprint Trial mold sales

Services for functional material development

• Plasma resistance evaluation of resin materials and ceramics
• Evaluation of thin-film alloy by Co-Sputtering with dual  targets.
• Desktop nanoparticle generator "VSparticle"

MEMS Volume Production Foundry "Silex Microsystems"

• Original TSV technology "Sil-Via^®" "Met-Cap^®"
• Unique TGV technology for thin MEMS devices

MEMS Multi Project Wafer (Shuttle service)

Visualization of factories ･ Countermeasures against aging (resolving issues of labor shortage, aged equipment)

Solutions for issues at factories and production sites

Maintenance parts (Sale, Cleaning, Repair, Refurbish, Overhaul)

• Chuck Cleaning Wafer (CCW)
• DolDol motor & driver
• PC/FC98 ⇒ Windows emulator
• Dual HDD mirroring system
• FD ⇒ Compact Flash (CF) converter

IoT for smart factory

• Water Leakage Monitoring System
• OKUDAKE SENSOR
• Analogue meter visualization service
• AceReal Assist (Remote supporting system)
• Meister AR Suite^TM
• AI ROBOTS solution
• Field Work Visualization Package (Meister Apps^TM)

PHASERAY Technology

• Inspection lighting system with an integrated magnifying glass “InVIEW CIRCLE LIGHT”