We shall exhibit at "MEMS Sensing & Network System Exhibition 2023"
Dec. 26, 2023
We will exhibit at "MEMS Sensing & Network System Exhibition 2023" to be held from 1/Feb/2023.
Details are as follows.
Details
Date & Time | Feb.1st(Wed) to 3rd(Fri) of 2023, 10:00~17:00 |
---|---|
Venue | Tokyo Big Sight, East 1 Hall |
Booth NO. | 1D-17 |
Visitor Registration | https://nanotech2023.jcdbizmatch.jp/en/Registration |
Contents
MEMS prototyping / Manufacturing total solution
Utilizing our in-house processing facility and global networks, we provide optimal solutions designing, prototyping, and volume production of MEMS devices in accordance with your budget and schedule.
[ Process examples ]
- Thin film coating (Sputtering, Evaporation, CVD, Plating, ALD, etc.)
- Photolithography (Aligner, Stepper, EB, etc.)
- Etching (Wet, Dry, High aspect ratio deep etching (ICP), Ion milling, etc.)
- CMP (Flattening of various thin films, Flattening before direct bonding, etc.)
- Wafer bonding (RT bonding, Plasma bonding, Anode bonding, Eutectic bonding, etc.)
- Ion implantation
- Thermal processing/Annealing (Laser anneal, RTA, Thermal diffusion furnace, etc.)
- Dicing/wafer thinning process (Dicer, stealth dicing, BG process, etc.)
- Nano imprinting (Mold fabrication, Resin transfer process, Anti-sticking treatment, various consulting)
[ Introduction to MEMS foundry – Silex Microsystems ]
- Unique TSV technology [Sil-Via®], [Met-Via®]
- Unique TGV technology for thinning MEMS devices
- Volume production of PZT film
- Smart Block™
[ Polymer MEMS development ]
- Nano-micro structure formation technology on polymers, and equipment sales.
- Fine patterning on non-flat substrates such as films and sheets
- Supporting 8inch or smaller
- UV nano-imprint system “TEX series”
Nano Imprint Total Solution
Providing comprehensive services from mold fabrication to imprinting
- Fine mold
- Various trial molds (Si, Ni, Quarts)
- Mold replication, cleaning service
- Consulting
If you intend to visit the event, do not hesitate to stop by our booth.