We shall exhibit at "MEMS Sensing & Network System 2024"
Dec. 22, 2023
We shall exhibit at "MEMS Sensing & Network System2024" which will be held from 31/Jan/2024.
Details are as follows.
Details
| Date & Time | Jan. 31st(Wed) to Feb. 2nd(Fri) of 2024, 10:00~17:00 |
|---|---|
| Venue | Tokyo Big Sight East 5 Hall |
| Booth NO. | 5C-15 |
Contents
MEMS prototyping production total solution
Utilizing our in-house processing facility and global networks, we provide optimal solutions designing, prototyping, and volume production of MEMS devices in accordance with your budget and schedule.
[ Process examples ]
- Thin film coating (Sputtering, Evaporation, CVD, Plating, ALD, etc.)
- Photolithography (Aligner, Stepper, EB, etc.)
- Etching (Wet, Dry, High aspect ratio deep etching (ICP), Ion milling, etc.)
- CMP (Flattening of various thin films, Flattening before direct bonding, etc.)
- Wafer bonding (RT bonding, Plasma bonding, Anode bonding, Eutectic bonding, etc.)
- Ion implantation
- Thermal processing/Annealing (Laser anneal, RTA, Thermal diffusion furnace, etc.)
- Dicing/wafer thinning process (Dicer, stealth dicing, BG process, etc.)
[ Introduction of MEMS foundry – "Silex Microsystems" ]
- Unique TSV(Through Silicon Via) technology [Sil-Via®], [Met-Via®]
- Unique TSV(Through Glass Via) technology
- Unique capping technology [Sil-CAP®], [Met-CAP®], [TGV-CAP®]
- Volume production of PZT film
[ Flexible MEMS development ]
- Nano-micro structure formation technology on organic materials
- Fine patterning on non-flat substrates such as films and sheets
- Supporting 8inch or smaller
Nano Imprint Total Solution
Providing comprehensive services from mold fabrication to imprinting
- Fine patterned mold
- Various trial molds (Si, Ni, Quarts)
- Mold replication, cleaning service
- Lithography system (Phable series) suitable for sub-micron scale periodic pattern (e.g. wave guide, anti-reflection).
If you intend to visit the event, do not hesitate to stop by our booth.