Thin film deposition, etching and other fabrication services

Our company's foundry offers to our customers a strong process know-how, a wide range of targets in stock (approximately 120 different materials), various thin film deposition (including sputtering, evaporation, CVD) and etching processes (dry and wet etching). We respond to customers` requests for small-lot production while at the same time reducing the development costs and speeding up the prototyping processes for semiconductor, FPD, MEMS, solar and other applications.

We are pleased to receive requests for complete process services or parts of them

We can find a timely and effective solution to your problems

• When you don't have the needed equipment available.
• When you need data regarding a certain process or you need to make a sample,etc.
• When you do not own the needed equipment.
• When you do not own the materials needed for your thin film processing.
• When you want to order samples according to your design instead of manufacture them internally.
• When you want to outsource a complete thin-film fabrication process (or just a part of it).

Process capability list

We meet your fabrication requests using our decades-long expertise and several fabrication processes.

Thin film Deposition

Type	Methods, Devices	Remarks	Substrate size
Dielectric Deposition	Thermal oxidation	≦10µm	≦Φ2 to ≦Φ12
	ALD/ECR plasma	ALD : SiO2, Al2O3, HfO2, TiO2 ECR plasma : AlN, AlON, SiN, SiON	≦Φ8"*
	LP-CVD (Low pressure CVD)	Poly Si etc.	Φ2" to Φ6"
	PE-CVD (Plazma CVD)	SiO2, SiN, a-Si, etc.	≦Φ12"*
Metal Dielectric Deposition	Sputtering (PVD)	Metal, Alloy, Oxide, Nitride, Special material etc.	≦φ12”, Maximum < 730 x 640 mm2*
	Evaporation	Metal, Alloy, Oxide, Nitride, Special material etc.	≦Φ12"*
	Electro / Electroless Plating	Electro plating: Ni, Cu, Au, SnAg Electroless plating:Ni, Cu, Au	≦Φ12"*

* Please contact us for details of chip substrate, rectangular substrates, non-standard substrates, etc.

Patterning

Type	Methods, Devices	Remarks	Substrate size
Photolithography Process (Resist coating, Exposure, Development)	Photo mask	Variety of masks (Standard masks are in stock)	≦Φ12"
	Spin coating	Positive resist, Negative resist	≦Φ12"*
	Spray coating	Positive resist, Negative resist	≦Φ6"*
	Contact aligner	Capability: >3µm	≦Φ12"*
	Double side aligner	Capability: >3µm	Φ4 tp Φ8
	Stepper (i-line)	Capability: >0.5µm	Φ2 tp Φ12
	Nanoimprinting	Imprint resist (nano scaled)	Contact us (Other catalogs are available)
	E beam lithography	Capability: >50nm	≦Φ6"
Lift off	Lift off	Capability: >5µm	≦Φ8"*

* Please contact us for details of chip substrate, rectangular substrates, non-standard substrates, etc.

Etching

Type	Methods, Devices	Remarks	Substrate size
Dry Etching	Parallel plate RIE	Si etching, Quartz etching	≦Φ8"*
	ICP-RIE	Si etching, Quartz etching	Φ4", Φ6"
	Si Deep-RIE	Si (Through-Hole)	Φ4", Φ6"
	Metal etching	Al based, GaN etc.	≦Φ6"*
Wet Etching	TMAH, KOH	Select suitable etchant for each material	≦Φ12"*
	HF
	Various metal layer etching

* Please contact us for details of chip substrate, rectangular substrates, non-standard substrates, etc.

Ion implantation

Type	Methods, Devices	Remarks	Substrate size
Ion implantation	Mid current ion implantation High energy ion implantation	Avalable to dope over 60 species (High temperature is available)	≦Φ6"*
Annealing	High energy high speed annealing	Heat temperature 1800℃	≦Φ12"*

 * Please contact us for details of chip substrate, rectangular substrates, non-standard substrates, etc.

Bonding

Type	Methods, Devices	Remarks	Substrate size
Wafer bonding	Anodic bonding	Bond Glass and Si	≦Φ6"*
	Surface activation bonding	Bond between different materials	≦Φ12"*

* Please contact us for details of chip substrate, rectangular substrates, non-standard substrates, etc.

Polishing (CMP)

Type	Methods, Devices	Remarks	Substrate size
Wafer polishing	CMP	Metal: Au, Pt, Cu etc. Oxide: TEOS, SiO2 etc.	≦Φ12"*
	BG / Edge trimming	Various materials. Bevel cutting, Orientation flat polishing (Avalable of hollowing process)	Φ2" to Φ12

* Please contact us for details of chip substrate, rectangular substrates, non-standard substrates, etc.

Dicing

Type	Methods, Devices	Remarks	Substrate size
Dicing	Blade dicing Stealth dicing™	Processing with suitable conditions of various materials	≦Φ12"*

* Please contact us for details of chip substrate, rectangular substrates, non-standard substrates, etc.