Thin film deposition, etching and other fabrication services

Our company's foundry offers to our customers a strong process know-how, a wide range of targets in stock (approximately 120 different materials), various thin film deposition (including sputtering, evaporation, CVD) and etching processes (dry and wet etching). We respond to customers` requests for small-lot production while at the same time reducing the development costs and speeding up the prototyping processes for semiconductor, FPD, MEMS, solar and other applications.

We are pleased to receive requests for complete process services or parts of them

 

We can find a timely and effective solution to your problems

  • When you don't have the needed equipment available.
  • When you need data regarding a certain process or you need to make a sample,etc.
  • When you do not own the needed equipment.
  • When you do not own the materials needed for your thin film processing.
  • When you want to order samples according to your design instead of manufacture them internally.
  • When you want to outsource a complete thin-film fabrication process (or just a part of it).
We can find a timely and effective solution to your problems

Process capability list

We meet your fabrication requests using our decades-long expertise and several fabrication processes.

Thin film

Type Methods, Devices Remarks Substrate size
Insulation layer formation Thermal oxidation ≦10µm Φ2" to Φ300
AP-CVD SiO2, PSG、NSG etc. Φ4", Φ5"
LP-CVD Poly Si etc. Φ2" to Φ4", Φ6"
PE-CVD SiO2, SiN, a-Si, etc. Φ2" to Φ8"
Metal and insulation layer formation Sputtering (PVD) Metal, Alloy, Oxide, Nitride, Special material etc. Φ2" to Φ450、≦650 x 950
Evaporation Metal, Alloy, Oxide, Nitride, Special material etc. Φ2" to Φ300, ≦300 x 360
Electro / Electroless Plating Electro plating: Ni, Cu, Au, SnAg
Electroless plating:Ni, Cu, Au
≦Φ8", Square

Patterning

Type Methods, Devices Remarks Substrate size
Photolithography Process
(Resist coating, Exposure, Development)
Spin Coat Positive resist, Negative resist Φ2" to Φ8"
Contact Aligner Capability: >3µm Φ2" to Φ8"
Double Side Aligner (g-line) Capability: >1µm Φ4"
Stepper (i-line) Capability: >0.5µm Φ4", Φ6"
Nanoimprinting Imprinted resist (nano order) Ask for detail
E beam lithography Capability: >50nm ≦Φ6"
Lift off Lift off Capability: >5µm Φ2" to Φ8"

 

Etching

Type Methods, Devices Remarks Substrate size
 Dry Etching Parallel plate RIE Si etching, Quartz etching Φ2" to Φ8"
ICP-RIE Si etching, Quartz etching Φ4", Φ6"
Si Deep-RIE Si (Through-Hole) Φ2" to Φ6"
Sacrifical layer etching Si, SiO2 Φ2" to Φ6"
Metal etching Al, Al system Φ2" to Φ4"
Wet Etching TMAH, KOH Choose suitable Φ2" to Φ8"
HF Φ2" to Φ8"
Various metal layer etching Φ2" to Φ8"

Ion Implant

Type Methods, Devices Remarks Substrate size
Ion Implant Mid current Ion Implant
High energy Ion Implant
Possible to dope using 60+ elements Φ3" to Φ6"
Anneal High energy high speed annealing Heat temperature MAX 1800℃ ≦Φ8"

 

Bonding

Type Methods, Devices Remarks Substrate size
Wafer bonding Anodic bonding Bond Glass and Si ≦Φ8"
Surface activated bonding Possible to bond different materials together Ask for detail

Polishing

Type Methods, Devices Remarks Substrate size
Wafer bonding CMP Metal: Au, Pt, Cu etc.
Oxide: TEOS, SiO2 etc.
Φ2" to Φ300, Square

Analysis

Type Methods, Devices Remarks Substrate size
Surface analysis SIMS, ESCA, TEM etc. Various contract analysis services Ask for detail
Microscope observation of shapes in very small areas
Thermoanalysis

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製品分類1 Deposition, Photolithography, Etching
製品分類2
プロセス分類 Prptotyping, R&D
サムネイル画像 Thin film deposition, etching and other fabrication services
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