Photolithography Etching

Etching processing services : Photolithography, Dry/Wet etching

semiconductor photolithography etching fabrication services

The semiconductor photolithography/etching fabrication service offered by Kyodo International decreases the R&D costs, lessens the burden of fabrication and increases the development speed for our customers.

We use wet etching, ion milling, RIE etching among many other technologies in order to answer your manufacturing requests about circuit patterning, test patterning, improvement of the surface conditions, test evaluation, process conditions control, etc.
Nowadays, in order to perform the needed processes for deep etching and nanoimprint mold manufacturing, we currently employ our ICP and D-RIE technologies. Furthermore, in addition to thin film formation and etching, we offer a wide range of micro-technology processes such as exposure, ashing among others.

Capable of providing photolithography, etching

Photolithography

  • Contact aligner (maximum resolution 3µm)
  • i-line stepper (maximum resolution 0.5µm)
  • E-beam writing (maximum resolution 50nm)
Images of Resist coating, Exposure and Development

Etching

Etching

Etching equipment specifications

Photolithography - Etching

Material Al, Cu, Au, Ag, ITO, etc.
Insulating layer SiO2, SiN, etc.
Resist pattern Positive, negative, permanent resist, etc.
MEMS processing Three dimensional shape by isotropic – anisotropic etching
Mold Si, Quartz, resin, etc.
Microfluidic chip 2 liquid mixture, crossroads, meandering design, etc.

Processing example (1) : 1µm pillar structure (aspect 17)

pillar structure
Process Comments
Mask material SiO2
Resist Positive resist
Exposure Stepper
Developing TMAH 2.38%
RIE etching EXAM
Resist stripping Organic solvent
ICP etching SID-1246
Oxide removal HF

Processing example (2) : Cu pattern

Cu pattern
Process Comments
Resist Positive resist
Exposure Contact aligner
Developing TMAH 2.38%
Wet etching Acid based etchant
Resist stripping Organic solvent

Processing example (3) : Microfluidic chip

加工例(3):流体チップ
Process Comments
Mask material SiO2
Resist Positive resist
Exposure Contact aligner
Developing TMAH 2.38%
RIE etching EXAM
Resist stripping Contact aligner
ICP etching SID-1246
Oxide removal HF

We strive to meet customer desires and needs making full use of our facilities and capabilities. Also sub-micron and nano-size fabrication possible.

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製品分類1 Deposition, Photolithography, Etching
製品分類2 Photolithography, Etching
プロセス分類
サムネイル画像 Etching processing services : Photolithography, Dry/Wet etching
説明文
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