Sputtering targets and Bonding process
We offer distribution and bonding processing of sputtering target (planer and cylindrical) from specialty material for R&D to general material for volume production for Semiconductors, MRAM, Touch panel, Anti reflection film, Solar (Photovoltaic), Lithium ion battery, displays etc.
- We undertake manufacturing of sputtering target from small volume custom product to high volume.
- We offer reliable bonding which fits your budget based on long standing expertise and knowledge.
- In addition to planar type, we correspond to cylindrical (rotary) target and bonding which have advantages in cost and yield.
- Quality assurance by in-house Large size C-Scan inspection system (Ultrasonic) and Quality management system.
- In addition to our own facilities, we correspond to various needs by our global partners’ network.
- Proprietary high quality bonding material and processes.
We correspond to supply needs in various applications, sizes, materials, purity from small quantity. (Please ask for materials non available in below examples). In addition to planar type, we correspond to cylindrical (rotary, rotatable) target which have advantages in productivity and film thickness distribution for applications such as Photovoltaic (thin film, CIGS etc.), Flat Panel Display (FPD) and Optical thin film. According to material, we choose the suitable production method such as splay, fusion and sinter in order to offer high quality and reasonable cost cylindrical (rotary) target. Refurbishment and recycle of used target is also available.
Example of Application and Materials
- Battery : CuGa(In), Ga, In, Sn, ZnS, Solid Li compound
- Touch Panel : Si, Nb, ITO, SnO, Nb2Ox, Au(alloy), Ag(alloy), Cu(alloy)
- AR coat for touch panel : Si(alloy), Nb compound
- Demolding material for mold : C(alloy)
- Piezoelectric : PZT
- Circuit for FPD, Transparent conductive film : Al(alloy), Cu(alloy), ITO
- Construction glass : Al(alloy), Ag(alloy), Cu, SST
Anodic bonding, Ag, Al, Cr, Cu, Cu-Ga, Cu-In, In, In-Sn, Inconel, Mo, Nb, Ni, Ni-Cr, Ni-V, Si, Si-Al, Sn, SUS, Ti, Ti-Al, W, W-Ti, Zn, Zn-Al, Zn-Sn, Zr, AZO etc.
*Ask for purity degree and size
We realized incomparable high quality bonding by utilizing abundant basic data through sputtering target distribution, proprietary bonding technic, application-oriented solder selection, ultrasonic welder for robust bonding, large C-Scan inspection system (ultrasonic) etc. We correspond to high performance bonding such as cooling efficiency uniformization, crack free treatment etc.
Not only planar type, we correspond to long length cylindrical (rotary) target bonding by proprietary technologies.
Moreover, we correspond to various specific needs in agile and detailed way such as reduction of cost and delivery time by refurbishing backing plate with our systematic operation programme.
- 分類が複数ある場合は、| ←半角の縦棒で区切って連続で入力してください。
|製品分類1||Targets and Bonding|