Silex Microsystems:MEMS foundry services (support documentation)

Foundry capability

Lithography

  6 inch 8 inch
Contact 1:1 Aligner  Front/Back side  Front/Back side
Alignment Accuracy ∼1µm, front side ∼1µm, front side
∼2µm, back side ∼2µm, back side
Minimum Features ∼0.8µm, vacuum mode ∼0.8µm, vacuum mode
∼3µm, proximity mode ∼3µm, proximity mode
Stepper 5:1 Aligner  Front side  Front/Back side
Alignment Accuracy ∼0.1µm ∼0.1µm, Front side
- ∼0.3µm, Back side
Minimum Features ∼0.5µm ∼0.35µm
Resist Thicknesses 1∼10µm, >20µm Positive 1∼10µm Positive
1∼10µm, >20µm Negative 1∼10µm Negative
 BCB  available -
Lift-Off available -
Spray Coating available -

 Plasma Etching

  6 inch  8 inch
 DRIE available available
Dielectric Etching (SiO2, SiN, etc.) available available
Polysilicon Etching available available
Polymer Etching and Stripping - available
Metals Al, AlCu, TiW TiN, AlCu
Oxide ICP available -

 Plasma Deposition

   6 inch 8 inch
PECVD Oxide available available
PECVD Nitride available available
PECVD TEOS  - available
SACVD Oxide - available

Wafer Bonding

  6 inch  8 inch
Silicon Fusion Bonding available available
Au-Si, Au-Sn Eutectic Bonding available available
Anodic Bondin available available
Thermo-compression Bonding available available
Adhesive Bonding available available
Alignment Accuracy: Wafer Pairs  <5um  <3um
Alignment Accuracy: Multi-wafer Stacks  <5um  <3um
DI Wafer Clean (Megasonic; Brush) available available
Controlled Ambient or Vacuum available available

Back End

  6 inch   8 inch
Automated Dicing available available
Au and Al Wire Bonding available available
Lapping for Wafer Thinning and Polishing available available
Epoxy and Solder Die Attach available available

Furnace Process

   6 inch 8 inch
Thermal Oxidations (900-1050℃) Wet/Dry/Mixed Wet/Dry/Mixed
Annealing Processes
(densification, bond or forming gas)
available available
Vacuum Anneal available  -
Metal Sintering available available
 RTP available available
Doping Processes Z
(ion implantation, POCI)
available available
LPCVD nitride (standard, low stress) - available
Ant-Reflective Coatings available  -
LPCVD oxides (LTO, PSG, TEOS) available available
LPCVD Silicon Amorphous, Poly, Fine-Grain Poly Amorphous, Poly
(in-situ P-doped poly coming)

Wet Etching

   6 inch  8 inch 
Anisotropic silicon etching (KOH, TMAH) available  -
Wet etching of dielectrics
(i.e. different oxides and nitrides)
available -
Vapour HF available -
Wet cleaning process
(acid and solvent based)
 - available
Fully-automated Spin Solvent  - available

Metalization

   6 inch 8 inch 
Sputter Deposition Al, Au, Cr, Cu, Ti, TiW, AlCu Ti/TiN, Cu, W, AlN, Mo, AlCu
Evaporation Au, Cr, Ni, Pt, Si, Sn, Ti  -
Electroplating Au, Sn Ni, Au, Cu, Sn
Integrated Seed Layer Etch
Electroless Plating Au, Ni  -

Metrology

   6 inich 8 inch
SEM with CD-Tool available available
Ellipsometer available available
Interferometer available available
Inspection Microscopes available available
CD Microscopes available available
White Light Interferometer available available
Surface Profiler available available
Film Stress Measurement available available
Sheet Resistance (4-point probe) available available
Surfscan available available
 XRD available available

Testing

    6 inch 8 inch
Automated Probing available available
Automated Electrical Parametric Testing
available
Customer-specific Test Rig available available
Test Development
(Prototyping and Volume Production)
available available

Expertise in MEMS devices

  • Acceleration sensor
  • Gyro
  • Pressure sensor
  • Cantilever
  • Touch Membrane
  • Flow sensor
  • Filter structure
  • CMOS interposer
  • Needle structure
  • IR sensor
  • Cell analysis device
  • Microphone
  • RF switch
  • Lab-on-a-chip
  • Printer head
  • Drug delivery
  • Mirror structure
  • Optical bench
  • Micro pump
Expertise in MEMS devices