Desktop Electroplating System

A mobile electroplating unit which is space-saving and cost-saving. It has a Modular design and is custmizable. Manufactured by Silicet.

	Large Electroplating System	Compact Electroplating System
Cost	>Tens of millions Yen	Half a million Yen
Issues	Good in throughput and productivity but cost is high and maintenance is uneasy.	Mostly Lab ware which uses beakers. Placing beaker on heater and using stirrer to stir solution cause distribution of flow and temperature which lead to internal distribution of film and reproducibility.

The "Desktop Electroplating Unit" solves such problems.

Benefits

Easy to attach/detach wafer by wafer cassette. No leakage to backside of wafer.(fig.1)
Anode/Cathode distance (fig. 2 & 3), temperature, flow rate (fig.7) are easily adjustable
Possible to process in constant condition which leads to improvement of in-plane distribution and reproducibility.
Correspond to various applications and sizes.

Wafer Size	φ2, 3, 4, 5, 6, 8”
Wafer Thickness	100 to 600µm
Processes	Electrolytic Plating Electroless Plating Electroplating
Examples	Ni, Au, Ag, Fe, Cu (fig4, 5, 6)

Comparison to Conventional Technologies

Conventional Technology : Electroplating by beakers

By stirring heated solution by stirrer, it likely to cause distribution of temperature and flow of solution.
　⇒Difficult to get stable distribution of film. Also reproducibility is an issue

Electroplating process by Desktop Electroplating Unit

Easy to adjust anode/cathode in order to reduce usage of solution.
Flow is stable by supplying solution through hole-patterned plate at anode side.
Stabilize temperature distribution by supplying solution from temperature-adjustable tank.
180 degrees rotatable. Possible to process in the suitable position.
Stress free wafer holding is possible by dedicated wafer cassette (fig.1).
Selectable from 3 types of anodes (Inactive anode, soluble anode, anode basket).

Line-up and Options

Desktop Electroplating Unit

Type	Basic Configurations	Model
4" Unit	・Main Unit ・Wafer Cassette (Selectable from 4", 3", 2") ・3 types of anodes Selectable from Inactive anode, soluble anode and anode basket	EP-U-4
6" Unit	・Main Unit ・Wafer Cassette (Selectable from 6", 5", 4", 3", 2") ・3 types of anodes Selectable from Inactive anode, soluble anode and anode basket	EP-U-6
8" Unit	・Main Unit ・Wafer Cassette (Selectable from 8", 6", 5", 4", 3", 2") ・3 types of anodes Selectable from Inactive anode, soluble anode and anode basket	EP-U-8

Option

Type	Basic Configurations	Model
Cart	Unit size : 2 to 8"	C3-8
Current Supply	Low Voltage Current Supply	NTN35-65
Tank	Glass tank with lid	GTL
Pump	Gear pump and Pump driver	Z-120
Heater	Heater with stirrer	C-MAG HS7

Desktop Electroplating Unit System Configurations

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製品分類1	Microfabrication Tools
製品分類2	Electroplating System
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