- KYODO INTERNATIONAL INC./Japan
- Electronics MEMS
- Sputtering Target and Bonding Process
Sputtering Target and Bonding Process
With abundant original data and technologies,
we achieved high quality & low cost sputtering target and bonding.
We started from dealing with various kinds of sputtering targets. Since then, we have accumulated abundant basic data. Moreover, we developed competitive large size target bonding through development of an original bonding method technique of the best solder selection, according to the application; also implementation of ultrasonic welder to strengthen the embrocating, etc. We are able to provide high quality bonding service, such as a realization of cooling uniformity and resistance to crack.
Moreover, we meet customers' various specific requirements quickly and precisely with capability to combine lower cost and shorter lead time by using systematic operation program.
We also offer the same service in Taiwan using the local factory.
| Bonding process | ||
|---|---|---|
| 1 | Receiving inspection | Inspect size of Target & backing plate, appearance,warp and strain. |
| 2 | Pre-processing | Target mask, back side process, cleaning, debond used target. |
| 3 | Bonding | Solder the target together with the backing plate, and bond them. |
| 4 | Warp rectification | Warp rectification after solder is settled. |
| 5 | Flatness inspection | Measure flatness by height gauge etc. on the platen. |
| 6 | UT inspection | Measure adhesion rate by Ultrasonic C-scan test. details » |
| 7 | Finishing | Execute blast and polish. |
| 8 | Cleaning and drying | Cleaning and drying. |
| 9 | Appearance inspection | Inspect stain and crack on target and backing plate. |
| 10 | Vacuum pack | Vacuum pack by laminate film. |
| 11 | Shipping | |
| Possessing Equipment | |||||
|---|---|---|---|---|---|
| Hot plate (small) | 1000×1000 | 3 | Sand blast | 800×800×400 | 1 |
| Hot plate (middle) | 1400×1400 | 1 | Sand blast | 400×650×400 | 1 |
| Hot plate (large) | 1600×1600 | 1 | UT(C-Scan) | 1280×1300 | 1 |
| Platen | 800×800 | 1 | |||
Cylindrical target & bonding service
Lately, in the area of Photovoltaic (thin film, CIGS etc,), Flat Panel Display (FPD), Optical film, thin film coating technology by cylindrical (rotatable, rotary, cylindrical, tube) target which improves productivity and film thickness distribution in plane.
Compared with conventional rectangular target, cylindrical target realizes lifetime of target tremendously so that it maximizes usability of precious rare metal.
We have started offering target supply and bonding service aiming growth of equipment which mounts rotatable target.
We apply the best production method such as thermal spray, fusion and sinter depend on requested material in order to propose high quality and reasonable-cost target. Also we undertake only bonding.
| Available Material |
|---|
| Anodic bonding, Ag, Al, Cr, Cu, Cu-Ga, Cu-In, In, In-Sn, Inconel, Mo, Nb, Ni, Ni-Cr, Ni-V, Si, Si-Al, Sn, SUS, Ti, Ti-Al, W, W-Ti, Zn, Zn-Al, Zn-Sn, Zr, AZO etc Ask for purity and size. |
We undertake bonding work of cylindrical target alone.
Sputtering Target
and Bonding
TEL)+81-044-852-7575 (Did)
FAX)+81-044-854-1979
KYODO INTERNATIONAL INC.
2-10-9 Miyazaki,
Miyamae-ku, Kawasaki-shi,
Kanagawa-ken, 216-0033,
Japan
FAX)+81-044-854-1979
2-10-9 Miyazaki,
Miyamae-ku, Kawasaki-shi,
Kanagawa-ken, 216-0033,
Japan
