- KYODO INTERNATIONAL INC./Japan
- Electronics MEMS
- MEMS Total Solution
MEMS Total Solution
Our company has semiconductor process equipment and material knowledge ;
by using our Kyodo's network (within Japan and abroad), we offer our clients
a wide range of service: from the trial manufacture of various MEMS to mass production.
MEMS Prototyping
- Thin Film, Patterning
- Thin film fabrication (Sputtering, CVD, Evaporation, etc).
- Photolithography, Etching (Dry etching(ICP/RIE/D-RIE), wet etching)
- Sacrifice layer etching (HF Vapor etching).
- 3D patterning by Gray Scale Mask
- CMP Fabrication Services
- We offer the most suitable CMP process for MEMS.
MEMS Volume Production
- Si through VIA wafers, Micro-mirror Array, RF-MEMS, etc.
- MEMS foundry according to our client's design.
- All Si VIA wafer (unique technology)
Microfluidic Chip
- Microfluidic Chip-TAS
- Fabrication services for many types of material (glass, Polymer, PDMS, Si).
- Chip peripheral devices and chip line-up.
MEMS Development Tools
We propose superior MEMS processing tools from prototyping to
medium size production and R&D. Proposal of tool customization is also available.
- Pulse Laser Deposition (PLD) System
- Realizes deposition of high quality PZT. Piezoelectric constant d31 – 130pm/V, d33 – 180pm/V
- Wafer/Substrate Holder for MEMS Processing
- This tool eliminates the need of backside resist/mask protection, because there is a vacuum adsorption instead. Suitable for device fabrication, which requires double side processing.
- UV Exposure System for MEMS
- UV optical device for MEMS which is compact and the best for lab (Offers only light source ).
Double sides optical ability.- Options: UV nanoimprinting, etc.
- Solar Simulator
-
OAI's solar simulator is a system which enables measurement of photovoltaic energy conversion efficiency under the same condition.
- Single wafer Multi-purpose Spin Processor
- Resin-made body enables users to apply various solutions. This tool is usable not only for spin coating, but also for various processes such as spin dry and etching.
- "POLOS" hot plate
- For Pre-bake, Post-bake, Curing etc. Applicable for various wafers. Expandable for your application, customizable to mount multiple heaters.
- Wafer Bonder
- From alignment through bond in the same chamber. Enables to apply different temperature for upper and bottom substrates.
- IR inspector "MEMSCAN"
- Nondestructive measurement of air gap, membrane thickness etc. Enables thickness measurement per each layer in multi layered structure.High throughput performance enables prototyping to volume production.
MEMS Total Solution
MEMS Prototyping
MEMS Volume Production
Microfluidic Chip
MEMS Development Tools
TEL)+81-044-852-7575 (Did)
FAX)+81-044-854-1979
KYODO INTERNATIONAL INC.
2-10-9 Miyazaki,
Miyamae-ku, Kawasaki-shi,
Kanagawa-ken, 216-0033,
Japan
FAX)+81-044-854-1979
2-10-9 Miyazaki,
Miyamae-ku, Kawasaki-shi,
Kanagawa-ken, 216-0033,
Japan
