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 Electronics Dpt.
TEL)
+81-044-852-7575
FAX)
+81-044-854-1979
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Generally, nondestructive inspection methods, like X-ray transmitted contrast and ultrasonic crack inspection are known for a long time, but in case we are talking about bonding items of the sputtering target, our company have adopted ultrasonic inspection as a result of evaluation. The superiority of ultrasonic inspection is in its capability to detect the position and shape of defects by scanning air bubble (void).
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Put the object to be inspected horizontally in the water and the probe vertically. The ultrasonic pulse is transmitted from the probe, after which the reflection echo from the bonded surface will detect the flaws from the gate. At that moment, while the probe is keeping a certain distance (focal distance), the confirmation of the flaw's position and shape is made by an automatic scan.
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| X-Y Scanner |
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Ultrasonic inspection controller |
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Each material, every shape ( thickness) measurement condition is decided. Measurement condition conforms to the UT inspection standard.
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The bonded area of the bonded items is evaluated, according to a certain qualification standard.
Our qualified products have more than 95% of bonded area in standard ( less than 2% of bonded surface as individual void).
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